The Dimensity 6300 is MediaTek’s Latest Mid-tier Chipset
Related Articles
-
MediaTek announces Dimensity 6300 SoC
6nm update of the Dimensity 6100+ MediaTek has announced its newest Dimensity 6300 SoC that will be coming to mid-range smartphones this year. Built on a 6nm manufacturing at TSMC, the Dimensity 6300 SoC is an octa-core SoC with two Cortex-A76 cores and six Cortex-A55 cores, paired up with Mali-G57
-
MediaTek Dimensity 6300 chipset announced
MediaTek announced its latest midrange chipset with the Dimensity 6300. This is a successor to last year’s Dimensity 6100+ featuring an overclocked main Cortex-A76 CPU cluster now working at 2.4Ghz instead of 2.2Ghz. The 2x Cortex-A76 cores are joined by 6x Cortex-A55 clocked at 2GHz. Dimensity 6300 is manufactured on TSMC’s 6nm process and features a Mali-G57 MC2 GPU. MediaTek claims the new chip should offer a 10% boost in CPU performance compared to the outgoing 6100+. Dimensity 6300...
-
MediaTek’s AI-Powered Dimensity 9300+ Arrives Soon
It's also speculated that Vivo might be the first OEM to feature the new SoC.